Wafer Edge Crack Inspect System > Semiconductor

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Major Products

Semiconductor

Content

Wafer Edge Crack Inspect System

Product Overview
System for inspecting various defects (including crack, scratch, particle, etc.) on wafer edge using a vision module
Specification
Category Spec

Defect Size

W @ 100um  / L @ 1,200um

Scan

Line scan camera (12K)

Lighting

LED

Inspect Method

Contrast calculation with background normalization

Application
  • Intended Use
    Visual inspection for wafer edge
  • Major Technology
    Optical design, Vision technology
  • Extended Application
    Vision System

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